NDLI: High-frequency characterization of direct plated copper metallized substrate and its application on microwave circuit

Content Provider	IEEE Xplore Digital Library
Author	Chien-Cheng Wei Chin-Ta Fan Ta-Hsiang Chiang Ming-Kuen Chiu Shao-Pin Ru
Copyright Year	2009
Description	Author affiliation: Tong Hsing Electronic Industries, LTD, 55, Lane 365, Yingtao Road, Yinko, Taipei Hsien, Taiwan 239 (Chien-Cheng Wei; Chin-Ta Fan; Ta-Hsiang Chiang; Ming-Kuen Chiu; Shao-Pin Ru)
Abstract	Direct plated copper (DPC) metallized substrate is introduced, characterized, and demonstrated in this paper. The proposed DPC metallized substrate has the main advantages of high-frequency characteristics and excellent thermal management, due to the use of ceramic substrate and metallized copper conductor. Besides, the DPC process also provides high circuit density, fine pitch, and low cost potential compared to other technologies, like direct bonded copper (DBC), Low-Temperature Cofired Ceramics (LTCC), and High-Temperature Cofired Ceramics (HTCC) processes. Therefore, to characterize the electrical properties of DPC substrate for high-frequency applications, a simple extraction method was adopted to carry out the correlated values of dielectric constant and dielectric loss at Ku-band. However, to validate the extracted parameters, a 10-GHz parallel-coupled line band-pass filter (BPF) was demonstrated by using the presented DPC substrate. This BPF has measured insertion loss of only 0.5dB and return loss of above 10dB in the passband. It obviously proved that the DPC metallized substrate is very capable for RF module packages and microwave components, with its excellent low loss performance.
Starting Page	681
Ending Page	684
File Size	1586598
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382279
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric constant Metallization parallel-coupled line filter Dielectric substrates band-pass filter Ceramics Direct plated copper dielectric material microstrip resonator Dielectric losses ceramic substrate Dielectric loss measurement Microwave circuits Thermal management Band pass filters Copper
Content Type	Text
Resource Type	Article

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