NDLI: High reliable medium profile copper foil for automobile PCB and IC

Content Provider	IEEE Xplore Digital Library
Author	Lin, S.C. Tai, C.C. Chen, K.C.
Copyright Year	2009
Description	Author affiliation: Technical Chief, Copper Foil Unit, Electronic Materials Division, Nan Ya Plastic Corp. 201 Tun Hwa North Road, Taipei, Taiwan (Lin, S.C.) \|\| Unit Manager, Copper Foil Unit, Electronic Materials Division, Nan Ya Plastic Corp. 201 Tun Hwa North Road, Taipei, Taiwan (Chen, K.C.) \|\| Engineer, Copper Foil Unit, Electronic Materials Division, Nan Ya Plastic Corp. 201 Tun Hwa North Road, Taipei, Taiwan (Tai, C.C.)
Abstract	The Nan Ya MP (Medium Profile) foil is designed to satisfy the market between high roughness HTE foils and low peeling VLP foils. This foil possesses optimum mechanical, physical and chemical properties, which is especially suitable for high reliability application. By the aid of well designed formula, the MP foil breaks the contradiction between low surface roughness and high peel strength. The peel strength of the MP foil is almost the same or even higher than HTE foil, and the surface roughness is lower than HTE foils. In order to achieve the low surface roughness and high peel strength of MP foils, the mountain-type nodule of raw foils are designed to be much lower and shorter, but the number is increased. By special nodule treatment technique, the high density nodules particles are deposited on the surface of MP foil. That is why the MP foils have low surface roughness and high peel strength. Owing to the optimum combination of raw foil and nodule treatment, the MP foils show excellent etching performance. Moreover, even after 250°C X 1hr oven condition, the MP foils almost maintain high tensile strength and elongation, thus the MP foils are much more reliable in high temperature lamination or in other high temperature application field (ie automobile PCB).
Starting Page	258
Ending Page	260
File Size	1898901
Page Count	3
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382126
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Ovens Surface roughness Mechanical factors Etching Rough surfaces Copper Automobiles Surface treatment Chemicals
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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