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| Content Provider | IET Digital Library |
|---|---|
| Author | Lin, X. Seet, B. C. Joseph, F. |
| Abstract | A novel method of bonding surface mount components to screen-printed fabric circuits is proposed. The method is achieved by applying the same technique of screen-printing conductive ink patterns of fabric circuit for printing a layer of low-temperature solder paste onto uncured conductive ink pads, and placing the circuit with mounted components inside an oven for a one-step curing process. A screen-printing frame with 42 μm mesh opening is used for both conductive ink and solder paste layers. Thus, a 0.2 mm resolution for printed traces and spaces is achieved, which meets the demanding geometrical requirements of most integrated circuit chips with fine-pitch and tiny footprints. Measurement results show the printed tracks after curing exhibit excellent conductivity while retaining good flexibility. Examination under the microscope shows the components are well-bonded to their on-fabric pads. The proposed method for surface component mounting and one-step curing process for screen-printed fabric circuits can potentially streamline and expedite the twin process of circuit fabrication and component mounting for future smart textile applications. |
| Starting Page | 1032 |
| Ending Page | 1034 |
| Page Count | 3 |
| ISSN | 00135194 |
| Volume Number | 52 |
| e-ISSN | 1350911X |
| Issue Number | Issue 12, Jun (2016) |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/el/52/12 |
| Alternate Webpage(s) | https://digital-library.theiet.org/content/journals/10.1049/el.2016.1044 |
| Journal | Electronics Letters |
| Publisher Date | 2016-05-16 |
| Access Restriction | Open |
| Rights Holder | © The Institution of Engineering and Technology |
| Subject Keyword | Circuit Fabrication Twin Process Fine-pitch Surface Component Mounting Fine-pitch Technology General Fabrication Technique Integrated Circuit Chips Integrated Circuit Packaging Microscope One-step Curing Process Product Packaging Screen-printed Fabric Circuit Screen-printing Conductive Ink Pattern Technique Screen-printing Frame Semiconductor Integrated Circuit Smart Textile Application Solder Paste Layer Solders Surface Mount Component Bonding Surface Mount Technology Uncured Conductive Ink Pads |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electrical and Electronic Engineering |
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