NDLI: Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot

Content Provider	IEEE Xplore Digital Library
Author	Seo Young Kim Kyudae Hwang Jongmin Moon Sarng Woo Karng
Copyright Year	2009
Description	Author affiliation: Department of Industrial Japanese, Yuhan University, Gyeonggi 422-749 R.O. Korea (Kyudae Hwang) \|\| Graduate School of Mechanical and Information Engineering, University of Seoul, Seoul 130-743, R.O. Korea (Jongmin Moon) \|\| Energy Mechanics Research Center, Korea Institute of Science Technology, Seoul 130-650 R.O. Korea (Seo Young Kim; Sarng Woo Karng)
Abstract	Thermal management for two array types of a serial circulation and a two-way parallel circulation using six mini liquid-cooled cold plates were experimentally measured in this study. In order to reduce weight of the cooling devices for humanoid robot cooling, the cold plates were covered with non-metallic material (polycarbonate, PC). Six cold plates attached on 10 x 10 $mm^{2}$ copper base: 0.5 x 0.5 $mm^{2}$ pin-finned surfaces of 1.5 mm high with 0.5 mm array spacing, was mounted on six copper heating blocks with isothermal conditions of 50~90°C, respectively. In order to compare thermal characteristics according to two circulation types, the surface temperatures of heating blocks and the cooling water temperatures at inlets and outlets of cold plates were measured. From the results, it was found that a two-way parallel circulation was better performance than a serial circulation in terms of total thermal resistance, total heat transfer rate, and surface temperature rises from first heating block to last one for six multiple cold plates.
Starting Page	453
Ending Page	456
File Size	1382635
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382215
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Cooling Cold plates Surface resistance Thermal resistance Humanoid robots Thermal management Copper Heat transfer Resistance heating
Content Type	Text
Resource Type	Article

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