NDLI: Interfacial reactions of Sn-0.7Cu, Sn-58Bi and Sn-9Zn lead-free solders with the Au/Ni/SUS 304 substrate

Content Provider	IEEE Xplore Digital Library
Author	Kuen-da Chen Hao Chen Yee-wen Yen
Copyright Year	2009
Description	Author affiliation: Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei, Taiwan, ROC (Kuen-da Chen; Hao Chen; Yee-wen Yen)
Abstract	This study investigates the interfacial reactions between three kinds of lead-free solders, Sn-0.7 wt%Cu (SC), Sn-58 wt%Bi (SB) and Sn-9 wt%Zn (SZ), and Au/Ni/SUS 304 substrates. The reaction temperatures were at 240, 255 and 270 °C, and the reactions times were varied between 1 to 5 hours. According to experimental results, only the (Cu,Ni)6Sn5 phase was found in the SC/Au/Ni/SUS 304 couples. When the Ni layer was completely consumed, the massive spalling of the (Cu,Ni)6Sn5 phase was found in the solder. And then the FeSn2 phase was formed at the SUS 304 surface. Only the Ni3Sn4 phase was found at the SB/Au/Ni/SUS 304 interface. In the SZ/Au/Ni/SUS 304 couple, the Ni5Zn21 phase was formed at the interface. The thickness of the IMC in the SB/Au/Ni/SUS 304 and SZ/Au /Ni/SUS 304 couples increased with increasing the reaction time.
Starting Page	606
Ending Page	608
File Size	917710
Page Count	3
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382258
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gold Scanning electron microscopy Temperature Environmentally friendly manufacturing techniques interfacial reaction Sn-58 wt%Bi (SB) and Sn-9 wt%Zn(SZ) Steel Materials science and technology Optical microscopy Thermal resistance Sn-0.7 wt%Cu (SC) Lead Solids Au/Ni/SUS 304 substrate
Content Type	Text
Resource Type	Article

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