NDLI: Thermal characterization of high thermal conductive graphites reinforced aluminum matrix composites

Content Provider	IEEE Xplore Digital Library
Author	Chih-Jong Chang Chih-Hao Chang Jen-Dong Hwang Cheng-Tzu Kuo
Copyright Year	2009
Description	Author affiliation: Industrial Technology Research Institute, Bldg. 52, 195-5 Chung Hsing Rd., Sec. 4, Chutung, Hsinchu 310, Taiwan, ROC (Chih-Hao Chang; Jen-Dong Hwang) \|\| Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan 300, ROC (Chih-Jong Chang; Cheng-Tzu Kuo)
Abstract	Due to the development of high power density and high heat flux of IC and LED components and devices, the thermal management of microelectronics has become a very critical issue in 3C and optoelectronic industries. This has lead to the requirement of high thermal performance materials and thermal modules. To enhance the thermal performance of current thermal modules, it is very important to develop advanced thermal management materials to replace the conventional monolithic metals. In this study some kinds of graphites reinforced aluminum matrix composites were developed. The effects of reinforcement types and its volume fraction on thermal properties such as thermal conductivity as well as the thermal expansion coefficient were studied. Moreover, their thermal performance such as heat spreading resistance and thermal resistance compared to pure aluminum and copper were also conducted. From the results, it showed that the thermal conductivity of graphite/Al composites can reach to 500~600 W/m.K in X-Y plane and 40~100 W/m.K in cross plane with thermal expansion less than 10 ppm/K and density less than 2.5 g/cc; The spreading resistance of this composite is 2~5% lower than the one of pure copper, and 25% lower than the one of pure aluminum.
Starting Page	461
Ending Page	464
File Size	1739887
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382217
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	heat spreading resistance Aluminum Light emitting diodes Microelectronics Conducting materials graphite/Al composite Thermal expansion Thermal resistance Thermal conductivity Thermal management Copper Energy management thermal management
Content Type	Text
Resource Type	Article

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