NDLI: The high performance electrodeposited copper foil for next generation

Content Provider	IEEE Xplore Digital Library
Author	Lin, S.C. Tsao, P.Y. Huang, C.C. Chen, K.C.
Copyright Year	2009
Description	Author affiliation: Technical Chief, Copper Foil Unit, Electronic Materials Division, Nan Ya Plastic Corp. 201 Tun Hwa North Road, Taipei, Taiwan (Lin, S.C.) \|\| Unit Manager, Copper Foil Unit, Electronic Materials Division, Nan Ya Plastic Corp. 201 Tun Hwa North Road, Taipei, Taiwan (Chen, K.C.) \|\| Engineer, Copper Foil Unit, Electronic Materials Division, Nan Ya Plastic Corp. 201 Tun Hwa North Road, Taipei, Taiwan (Tsao, P.Y.; Huang, C.C.)
Abstract	The aim of this study is to introduce the development status of advanced electrodeposited copper foil of Nan Ya Plastic Corp. for the requirement of next generation (High performance, ECO friendly, low cost, etc...). Owing to the diversity need of electronic industry, such as high density packaging, high frequency transmission, heat discharge, high reliability and eco-friendly..., different copper foil was or will be developed from the Nan Ya company to satisfy the customers. For example, ultra thin carrier foil (thickness range from 2 to 6um) and super low surface roughness foil (NPV series) are used to meet the application of high density packaging and IC substrate. Thick and smooth NPVP foils are applied in the high current and heat discharge situation. Black NPVBR and NPHB foils are expecially used in EMI shielding field. The optimum NPM foils (under development) possess excellent etching ability, high peel strength, superior mechanical properties and environment friendly; foils. For the 2L FCCL industry, etching and flexibility are important performance requirement. The very low surface roughness and high flexible copper foil (namely NPVT foils) are designed to meet this requirement. The NPVT foil exhibits the different metallurgical microstructure as compared to traditional HTE foil, such as fine grain size, equiaxed grain structure and (111) preferred orientation. These characters make the foils having superior mechanical and etching properties. Owing to special treating technique, the copper foils have smooth surface roughness, high adhesive strength, and less surface powder. After high temp lamination (PI), the fine grain can be annealed to become larger equiaxed grain structure. The NPVT foils will transform to higher elongation and more flexibility, which is suitable for the FCCL application.
Starting Page	254
Ending Page	257
File Size	2382996
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382125
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Costs Surface discharges Packaging Surface roughness Etching Mechanical factors Rough surfaces Copper Plastics Surface treatment
Content Type	Text
Resource Type	Article

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