NDLI: Micro focusing deformable mirror fabricated by combination with silicon based and nonsilicon based micromachining

Content Provider	IEEE Xplore Digital Library
Author	Meng-Ju Lin
Copyright Year	2009
Description	Author affiliation: Department of Mechanical & Computer-Aided Engineering, Feng Chia University, No. 100, WenHua Road, Taichung, Taiwan 40724 (Meng-Ju Lin)
Abstract	In this work, a micro focusing deformable mirror is designed for fabricated by combination with silicon and nonsilicon based micromachining. The upper electrode and mirror is designed and made by traditional silicon based micromachining in silicon substrate. And lower electrode is fabricated at aluminum substrate. However, the lower electrode is fabricated by nonsislicon based micromachining. From results of numerical analysis, the mirror shape under electrostatic force is parabolic like. Therefore, it would have good focusing performance. And the relationship between structure and metal layers thicknesses of mirror and applying voltages is investigated. The effect of some sizes of mirror on pull-in voltage is also discussed. And then the deformable focusing mirror is fabricated. Due to wafer bonding methods often used in semiconductor like anodic bonding being not suitable used between silicon and aluminum substrates, photo resist SU8 is used to bonding the tow substrates for its good adhere property. And the two substrates are boned tightly and have good isolation between upper and lower electrodes. Some experiments are done to investigate performance of micro deformable focusing mirror. The results show that the mirror needing large applying voltages to deform for large thickness of SU8 photo resist. And the SU8 adhered to silicon and aluminum would be burned to core for too large applying voltage. Therefore, for practical use, other photo resists with thinner thickness should be used instead of SU8. However, the results show photo resist can be used as wafer bonding method for substrates of different materials. And micro focusing mirror designed in this work would have useful focusing ability.
Starting Page	315
Ending Page	318
File Size	1638809
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382180
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrodes Wafer bonding Numerical analysis Aluminum Micromachining Voltage Resists Silicon Mirrors Substrates
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Optical scanner with deformable mirror fabricated from SOI wafer

Bulk silicon micro electro mechanical devices fabricated from commercial BESOI substrates

Fabrication of micro mirror array with vertical spring structure

Surface micromachined structures fabricated with silicon fusion bonding

Design And Fabrication Of Micro Mirror Supported By Electroplated Nickel Posts

A miniature Fabry-Perot interferometer fabricated using silicon micromachining techniques

Bulk micromachined electrostatic beam steering micromirror array

An improved electrostatically-driven micro torsion mirror fabricated by silicon micromachining for optical switching devices

Varifocal scanning micro-mirror fabricated from silicon-on-insulator wafer

Micro focusing deformable mirror fabricated by combination with silicon based and nonsilicon based micromachining

Similar Documents

Optical scanner with deformable mirror fabricated from SOI wafer

Bulk silicon micro electro mechanical devices fabricated from commercial BESOI substrates

Fabrication of micro mirror array with vertical spring structure

Surface micromachined structures fabricated with silicon fusion bonding

Design And Fabrication Of Micro Mirror Supported By Electroplated Nickel Posts

A miniature Fabry-Perot interferometer fabricated using silicon micromachining techniques

Bulk micromachined electrostatic beam steering micromirror array

An improved electrostatically-driven micro torsion mirror fabricated by silicon micromachining for optical switching devices

Varifocal scanning micro-mirror fabricated from silicon-on-insulator wafer

Micro focusing deformable mirror fabricated by combination with silicon based and nonsilicon based micromachining