NDLI: Performance analysis in modeling micro capacitive pressure sensor

Content Provider	IEEE Xplore Digital Library
Author	Chun-Shan Tsui
Copyright Year	2009
Description	Author affiliation: Pitotech, No.17,Lane 95, Tzu Chiang Rd., Chang Hua City, Taiwan (Chun-Shan Tsui)
Abstract	In this paper, a finite element numerical (FEM) simulation via COMSOL Multiphysics was carried out to study the performance of micro capacitive pressure sensor. At first stage, the effect of fabrication was considered. At second stage, calculating the relationship between capacitance and applied pressure under different operation condition, including bonding temperature, thermal expansion coefficient of silicon and thickness of pressurized compartment by using Taguchi Method. Finally, finding the best condition of fabrication and operation. The simulation showed that capacitance of the sensor was as the function of the operating pressure. The higher bonding temperature was fabricated, the lower capacitance can be achieved under the same applied load. And thinner thickness of the pressurized compartment provided good resolution. Thus, the performance of micro capacitive pressure sensor can be predicted with qualitative analysis and with quantitative analysis via numerical simulation.
Starting Page	39
Ending Page	42
File Size	1625812
Page Count	4
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382303
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Temperature sensors Thermal expansion Capacitance Numerical simulation Capacitive sensors Silicon Performance analysis Finite element methods Bonding
Content Type	Text
Resource Type	Article

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