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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kuo-Chun Hsieh Shwin-Chung Wong |
| Copyright Year | 2009 |
| Description | Author affiliation: Department of Power Mechanical Engineering, National Tsing Hua University, Hsin-Chu 300, Taiwan, R.O.C. (Kuo-Chun Hsieh; Shwin-Chung Wong) |
| Abstract | The performance of a novel vapor chamber is tested in this study. In this vapor chamber, parallel grooves are made on the inner surface of the top plate, with inter-groove openings, to replace the conventional porous wick. To the inner surface of the bottom plate is sintered a layer of porous wick as the evaporator. The peaks of the groove walls directly contact with the wick so that the grooves function as vapor path, condenser and structural supporters simultaneously. The corrugated groove walls provide not only an enlarged condensation area, but also a direct shortcut for a portion of the liquid condensed on the groove surface to be absorbed back to the wick. Thus, smaller liquid-flow resistance and hence high anti-dryout capability are achieved. The test module includes a copper plate-fin heat sink in combination with a top fan. In this study, the evaporator wick was made of sintered multi-layer copper screens and the footprint of the vapor chamber was 10 cm × 8.9 cm. With a 2.1 cm × 2.1 cm or a 1.1 cm × 1.1 cm heating area, the vapor chamber resistances were measured for heat load increasing from 80 W to beyond 300 W. Good performances with low vapor chamber resistance and large heat load limit were obtained under different orientations. |
| Starting Page | 573 |
| Ending Page | 576 |
| File Size | 1525941 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424443413 |
| DOI | 10.1109/IMPACT.2009.5382249 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-10-21 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Corrugated surfaces Electronics cooling Thermal resistance Surface resistance Aluminum Containers Copper Heat sinks Testing Resistance heating |
| Content Type | Text |
| Resource Type | Article |
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