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2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference

Welcome message from Yi-Jen Chan, conference general chair

Welcome message from Shen-Li Fu, conference co-chair

Welcome message from K. N. Chiang, conference co-chair

Welcome message from An-Yeu Wu, conference co-chair

Welcome message from Simon Chen, conference co-chair

Session 1: Design, modeling & testing I

Birefringence simulations of annealed ingot of calcium fluoride single crystal by considering creep behavior of ingot during annealing process

Application of viscoelastic model for simulating process-induced warpage of ball grid array packages

Thermal-structural coupled analysis in heating cycle of semiconductor

3-D finite-element modeling of multi-finger high-power amplifiers with compact heat-dissipation packaging structures

Electro-thermo-mechanical design and electromigration analysis for Package-On-Package (POP)

The influences of temperature cycling parameters on the reliability of the solder joints in the high-density package assemblies by Taguchi Method

A study for the new-type ACF applications of FCOF assembly

Three-dimensional CAE of wire sweep and paddle shift in microchip encapsulation

Performance analysis in modeling micro capacitive pressure sensor

Session 2: Advanced packaging I

Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering

Simulation and experiments of fan-out wafer level package during encapsulation

Reliability analysis of copper interconnections of system-in-packaging

20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives

Optical analysis and measurements of high-power COP LED packages

Effects of Ni addition to high-lead solders on the growth of Cu3Sn and micro voids

Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC

Fundamental study of 95 high-lead solder bump on substrates pre-soldered with eutectic PbSn

Session 3: HDI, embedded & advanced technology

Electroplating equipment design considerations for copper microvia filling

A new embeddable copper oxide based thin film resistor material

ACP Mfg. tech. for rigid & flex board interconnection

Evolving into the age of digital ink jet solder mask printing

Flexible printed circuit (FPC) board for mobile antennas operation

Artificial dielectric material and artificial magnetic conductor for emerging PCB application

A novel high performance substrate and the processes thereof

An in-depth study on the fabrication of 1055–1064 nm multi-quantum-well and super-lattice laser diodes

Design for the enhancement of anti-vibration characteristics of surface mount type electronic components

Analysis of promising copper wire bonding in assembly consideration

Session 4: SPIL session

Flux study for ultra fine pitch flip chip packages

Film type solder mask evaluation for flip chip BGA

Originality method in selecting high CTE molding underfill for low profile molded FCCSP

Optimization of copper pillar bump design for fine pitch flip-chip packages

Advanced integrated passive device (IPD) low pass filter designs on WLCSP

Guarding trace and ground via-hole analysis for DDR interface designed in high-speed packages

Stress evaluations in micro bump structures of FCBGA

Warpage and stress characteristic analyses on wire-bond-S-FCCSP structure

The optimal DRIE parameter for bulk micro-machining process

Session 5: Reliability & electro-migration

Bonding and electromigration of 30µm fine pitch micro-bump interconnection

Direct measurement of hot-spot temperature in flip-chip solder joints with Cu columns under current stressing using infrared microscopy

Investigation of joule heating effect in various stages of failure in flip-chip solder joints under accelerated electromigration

Effects of electromigration on grain rotation behavior of SnAg solders

Board-level reliability of coreless flip chip package assembled on a printed circuit board

Session 6: 3D interconnection

Breakthroughs in chip embedding technologies leading to the emergence of further miniaturised system-in-packages

Stacking of known good rebuilt wafers without TSV applications to SiP /abandoned sensors

Thermal mitigation using thermal through silicon via (TTSV) in 3-D ICs

Novel Cu plating formula for filling through silicon vias

Session 7: LED thermal solution

Thermal management in high performance computers by use of heat Pipes and vapor chambers, and the challenges of global warming and environment

An investigation of thermal spreading device with thermal via in high power LEDs

High brightness LED assembly using DPC substrate and SuperMCPCB

The thermal analysis of sequential LED driven mode

The stratified thermal modules for the LCD TV with LED backlight

Session 8: Green PCB & PCBA I

Stretchable circuit board technology in textile applications

Influence of intermetallic compound on the stress distribution and fatigue life of halogen-free printed circuit board assembly

Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser

Optimization of solderability for 2.4GHz RF printed-circuit-board products

A study to stencil printing technology for solder bump assembly

Session 9: Nan Ya Plastics session

The effects of CCL composition on signal loss for high frequency application

The introduction of high heat dissipation material

The development trend of halogen-free substrate cores

Study of naphthalene epoxy resin for low CTE copper clad laminate

A novel resin composition for low Dk copper clad laminate

The high performance electrodeposited copper foil for next generation

High reliable medium profile copper foil for automobile PCB and IC

Session 10: Advanced packaging II

Effect of passivation opening design on electromigration reliability issue in flip-chip solder joints

Aging effects on interfacial reactions between Cu addition into the Sn-9Zn lead-free solder and Au substrate

The experimental measurement of wire sag of long wire bonds for 3-dimensional and multi-chip module packaging

Low-cost and high-performance front-end module for WLAN

Development of CRC block onn FPGA for Zigbee standard

Investigation of parasitic electromagnetic radiation in multilayer packages and MCMs

Session 11: MEMS, sensor & microsystems packaging

Multi-scale measurement of the change of the residual stress in a silicon chip during manufacturing from thin-film processing to packaging

Issues in path toward low cost three-axis accelerometer for low-g application

MEMS packaging IP and market status

A CMOS-MEMS single-chip dual-axis gyroscope

An optical anti-shake system with a tremor sensing module and compact linear piezomotors

Three-axis accelerometer in CMOS MEMS

Micro focusing deformable mirror fabricated by combination with silicon based and nonsilicon based micromachining

A low-g three-axis accelerometer IC

A study of residual stress effects on CMOS-MEMS microphone technology

Session 12: Advanced cooling technology I

Development of Thermal spreading technology nowadays

Evaporation resistance measurement with visualization for sintered copper-powder evaporator in operating flat-plate heat pipes

Thermal Performance of a Vapor Chamber Heat Pipe with Diamond-Copper Composition Wick Structures

Investigation of the polymer wick structure applied to loop heat pipe

Investigation of the effect of heat leak in loop heat pipes with flat evaporator

Manufacturing and testing of the sintered miniature loop heat pipe

Mathematical model of heat and mass transfer in a wick structure of a loop heat pipe

Effect of orientation on the convective boiling performance of microchannel heat sink using HFE-7100

Vapor chamber in high performance server

Investigation of the polymer wick structure applied to loop heat pipe

Session 13: Test, quality, inspection, reliability technology

Quantitative assessment of slit mura defect in thin film transistor-liquid crystal display based on chromaticity and optical density

Experimental/numerical analysis of halogen-free printed circuit board assembly under board level drop test

Aftershock effects on the reliability of electronic components under shock test

CPU socket warpage measurement during reflow temperature variation using shadow moiré

Failure analysis for electronic devices on flexible substrate

Electrical characterization of fine-pitch compliant bumps

Response prediction and verification for PCB with package due to thermal and random vibration coupling effects

Session 14: Design, modeling & testing II

Effect of UBM and BCB layers on the thermo-mechanical reliability of wafer level chip scale package (WLCSP)

Warpage measurement and design of wBGA package under thermal loading

Design and simulation study for stacked IC packages with spacer structure

Designs of temperature loads on the fatigue life analysis of lead-free solder in IC packages

Nonlinear study of large deflection of simply supported piezoelectric layered-plate under initial tension

Session 15: Green materials & process I

Bump shape control on high speed copper pillar plating process in lead-free wafer level packaging

Effect of micro-texture of electroplated copper thin-films on their mechanical and electrical reliability

Transmission electron microscopy characterization of the porous structure induced by high current density in the flip-chip solder joints

Electrochemical corrosion behavior of Pb-free solders for die attachment

Session 16: Novel thermal materials

Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot

Large-scale preparation of ternary BiSbTe films with enhanced thermoelectric properties using DC magnetron sputtering

Thermal characterization of high thermal conductive graphites reinforced aluminum matrix composites

High-power-used thermal gel degradation Evaluation on board-level HFCBGA subjected to reliability tests

Preparation and characterization of nano-inorganic materials coated multi-walled carbon nanotubes/epoxy composites for thermal interface materials

Session 17: Green materials & assembly I

Impact of surface treatment on high frequency signal loss characteristics

Base material consideration for high speed printed circuit boards

Session 18: Green PCB & PCBA II

Image transfer solutions for future demand

The evaluation of assembly process for package on package components

Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

Effect of minor alloying additions on the BIT reliability of SnAgCu solder joints

Comparative study of Au/Pd/Ni(P) surface finish in eutectic PbSn and Sn3Ag0.5Cu soldering systems

Session 19: Design, modeling & testing III

The correlation investigation between cyclic bending and thermal cycle testing in CSP package on board

Experimental investigation and finite element analysis of bump wafer probing

Improved ball-on-elastic-pad and ball-on-hole tests for silicon die strength

Development of wafer probe testing method and femsimulation model

Effect of solder pad opening size and various pad metallization substrates on Sn-Ag-Cu solder joint under high speed shear test

Optimum design of contact springs used in registered jack connectors

Failure mode evolution of WLCSP on board by dynamic bend method

Reliability and parametric study on chip scale package under board-level drop test

Interfacial toughness evaluation of SAC305 solder bump with pendulum impact test

Session 20: Green materials & process II

High reliability encapsulant liquid resin for SIP

Implementation and characterization of a tunable quality factor micromachined inductor

Nanotechnology for lead-free PWB final finishes with the Organic Metal

Carbon nano tubes grown on glass substrate with different interface layer

Development of UV stable LED encapsulants

Reliability of 20µm pitch NCF type COF package with compliant-bump

Session 21: Advanced cooling technology II

Performance tests on a novel vapor chamber

Thermal design strategy of server and storage products for 1U and 2U system

Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA

Thermal simulation and design of GaAs HBTs

Investigation of thermally conductive ceramic substrates for high-power LED application

Session 22: Green materials & assembly II

iNEMI HFR-free leadership program

Evaluating the efficiency of current reverse method applied to solder joints

Fine pitch BGA solder joint split in SMT process

Interfacial reactions of Sn-0.7Cu, Sn-58Bi and Sn-9Zn lead-free solders with the Au/Ni/SUS 304 substrate

The application of UV-LEDs to printed circuit board process

Failure analysis of (DIMM hole) solder void in lead free process used OSP coated PCB

iNEMI solder paste deposition project - First stage review optimizing solder paste printing for large and small components

Session 23: PTH & metal finishing

The study of the stability of Pd/PVP nanoparticles added with phosphoric acid and the activity to electroless Cu deposition

Effect of electroless palladium immersion gold deposit properties on gold wire bonding

Horizontal systems: Leading technology for next generation HDI production

Reliability test and IMC investigation of lead and lead free solder joints on different surface finish processes

Semiconductor component qualification

An efficient metrology to sense micro-metal contamination in fine-pitch package

Influence of plastic assembly yield with molding technology

Efficiency analysis of electroplating gold bump in assembly

Mechanism of pore formation in solid

Size and substrate effects upon undercooling of Pb-free solders

The impact investigation of CSP IC packaging on Halogen-free board level performance

Explore the impact of improvement that the Polyimide adhesive residue on QFN Package

Anti-wetting trench of nozzle plate for piezoelectric actuating dispenser

The structure of the carbon foam derived from meophase coal-tar pitch

High-frequency characterization of direct plated copper metallized substrate and its application on microwave circuit

A comparison study of high-frequency performance between ball bonding and ribbon bonding

Optimization design of cup-shaped copper heat spreaders for high-power InGaN/sapphire LEDs

Numerical and experimental study of thermal management on HB LED devices

Temperature effects on electrical characterization of high dielectric constant substrates

The development of high frequency induction heating embedded coil

Floor plan design for 3D multi-layer substrate

A new method for measuring characteristic impedances of CMOS interconnect transmission lines

Design optimization and analysis of a novel nanocomposite-film typed flip chip technology

Estimation design of MEMS-based inertial navigation systems with noise coupling input saturation: Robust approach

Design and fabrication of passive components using TF-IPD technology

MLP/BP-based MIMO DFEs for distorted 16-QAM signal recovery in severe ISI channels with ACI disturbances

Die crack study for 40 nm lead free flip chip packaging

A novel led driving circuits development for decorative lighting system energy saving

Design optimization and analysis of a novel nanocomposite-film typed flip chip technology

2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference

2007 International Microsystems, Packaging, Assembly and Circuits Technology

2006 International Microsystems, Package, Assembly Conference Taiwan

Welcome message from K. N. Chiang, conference co-chair

Content Provider	IEEE Xplore Digital Library
Author	Chiang, K. N.
Copyright Year	2009
Description	Author affiliation: IMAPS-Taiwan (Chiang, K. N.)
Abstract	As a co-program chair of IMPACT2009 and on behalf of IMAPS-Taiwan and Advanced Packaging Research Center of National Tsing Hua University (APRC- NTHU), it is my great pleasure to welcome you all for coming Taipei, to the 4th IMPACT conference. The value of this conference lies in the opportunity it provides for an in-depth dialogue between the academia/research institution and the industry, the PCB society and the packaging/MEMS societies. This annual conference has already established itself as a key event in the advanced packaging, MEMS and PCB related areas, I am sure we're all looking forward to some of the programs that have been scheduled. In the meantime, I very much hope that your participation in this conference will be both beneficial and enjoyable, and particularly for those of you from oversea, I trust that your stay here will be a pleasant one. Finally, I would like to acknowledge the efforts of the various parties such as ITRI, IMAPS-Taiwan, APRC-NTHU and TPCA, etc. in organizing this conference.
Starting Page	1
Ending Page	1
File Size	636455
Page Count	1
File Format	PDF
ISBN	9781424443413
DOI	10.1109/IMPACT.2009.5382192
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-21
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Content Type	Text

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