NDLI: Thermal Spreading Resistance Characteristics of a High Power Light Emitting Diode Module

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Lee, Ming-Tsang Yang, Kai-Shing
Copyright Year	2014
Abstract	In this study, effects of the dimensions and the thermal conductivity of the substrate on the heat transfer characteristics of a LED module are investigated. The total thermal resistance corresponding to a LED module operating at different power levels is measured using a thermal resistance testing system (T3Ster®). In addition, a novel graphite composite material with anisotropic thermal conductivities is used as the substrate of the LED module to investigate the effects of directionally dependent thermal conductivities on the thermal spreading resistance. Furthermore, a finite element method numerical simulation is carried out to analyze the heat transfer phenomena in the LED module. It is found that, for the current experimental conditions, the importance of the thermal spreading resistance effect increases with decreasing substrate thickness and/or increasing input power of the LED module, which corresponds to an increase in the total thermal resistance and correspondingly a higher chip temperature. Experimental and numerical results show that the thermal spreading resistance and thus the chip temperature can be reduced by increasing the substrate thickness or by utilizing materials with high lateral thermal conductivities for the substrate. In consequence, for LED modules with the same substrate thickness, using graphite composite to replace aluminum as the substrate material reduces the spreading resistance by nearly fourteen percent in the current study.
File Format	PDF
ISBN	9780791849569
DOI	10.1115/IMECE2014-36624
Volume Number	Volume 8B: Heat Transfer and Thermal Engineering
Conference Proceedings	ASME 2014 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2014-11-14
Publisher Place	Montreal, Quebec, Canada
Access Restriction	Subscribed
Subject Keyword	Temperature Computer simulation Aluminum Dimensions Finite element methods Light-emitting diodes Composite materials Thermal resistance Anisotropy Graphite Thermal conductivity Heat transfer Testing
Content Type	Text
Resource Type	Article

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