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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lei Zhang Dong Wang Weiping Tong |
| Copyright Year | 2008 |
| Description | Author affiliation: Shenyang Nat. Lab. for Mater. Sci., Chinese Acad. of Sci., Shenyang (Lei Zhang; Dong Wang) || Key Lab. of Nat. Minist. of Educ. for Electromagn. Prcessing of Mater., Northeast Univ., Shenyang (Weiping Tong) |
| Abstract | With size and pitch of the solder pad decreasing, solder bridging become one of the most common and critical defect in the high-density assembly process. Optimized geometry of solder with its pad is the guarantee of manufacturing process. By means numerical simulation technology, the wetting behavior of SnAgCu solder liquid on structured surface consisting of solder pad and solder mask was investigated. The solder liquid separation condition, that the solder height must below one and third quarter of the width of nonwetting zone, was verified. The simulation results demonstrate the validity of the criteria. |
| Starting Page | 1347 |
| Ending Page | 1350 |
| File Size | 2816472 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424421176 |
| DOI | 10.1109/EPTC.2008.4763618 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Numerical simulation Surface morphology Shape control Soldering Finite element methods Assembly Geometry Energy states Bridges Laboratories |
| Content Type | Text |
| Resource Type | Article |
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