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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Boutry, H. Souriau, J.-C. Brun, J. Franiatte, R. Nowodzinski, A. Sillon, N. Dubois-Bonvalot, B. Depoutot, F. Brunet, O. Peytavy, A. |
| Copyright Year | 2008 |
| Description | Author affiliation: CEA-LETI, Grenoble, France (Boutry, H.; Souriau, J.-C.; Brun, J.; Franiatte, R.; Nowodzinski, A.; Sillon, N.) || Hardware Security Res. Group, Gardanne, France (Dubois-Bonvalot, B.; Depoutot, F.) || Smart Packaging Solutions (SPS), Rousset, France (Brunet, O.) || ATMEL, Rousset, France (Peytavy, A.) |
| Abstract | Face to face interconnection is an important technology for the assembly of heterogeneously integrated systems; it permits the integration of technologies from disparate backgrounds and allows separate technology optimization prior to assembly. This paper reports work on the optimization of micro-insert technology, which allows the electrical connection between the two systems. SimCard Prototypes have been developed and evaluated in usual and moisture conditions.Thermal cycling of test structures between -40°C and + 85°C has been performed at wafer level and results indicate that the average resistance of the daisy chain observed between the two devices does not change. However, electrical yield of the structures under damping tests @85°C and 85% of humidity decrease significantly as a consequence of the glue degradation. However further damping tests have been realized on the final packaged cards without any deterioration of the prototype. |
| Starting Page | 1334 |
| Ending Page | 1339 |
| File Size | 5656430 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424421176 |
| DOI | 10.1109/EPTC.2008.4763616 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Flip chip Prototypes Testing Assembly systems Damping Moisture Performance evaluation Electric resistance Humidity Degradation |
| Content Type | Text |
| Resource Type | Article |
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