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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ho-Young Son Kyung-Wook Paik Ilho Kim Jin-Hyoung Park Soon-Bok Lee Gi-Jo Jung Byung-Jin Park Kwang-Yoo Byun |
| Copyright Year | 2008 |
| Description | Author affiliation: Dept. of Mater. Sci. & Eng., KAIST, South Korea (Kyung-Wook Paik) || Dept. of Mech. Eng., KAIST, South Korea (Ilho Kim; Jin-Hyoung Park; Soon-Bok Lee) || Package Dev., Hynix Semicond. Inc., Icheon, South Korea (Ho-Young Son; Kwang-Yoo Byun) || Nepes Corp., South Korea (Gi-Jo Jung; Byung-Jin Park) |
| Abstract | A thick Cu column based double-bump flip-chip structure is one of the promising alternatives for fine pitch flip-chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip-chip assemblies was firstly investigated and the failure mechanism was analyzed through correlation of T/C test and the finite element analysis (FEA) results. In addition, the effect of Cu column height was investigated for the enhancement T/C reliability. The T/C failure site was the Cu column/Si chip interface, where was identified via a FEA as the location of the maximum stress concentration during thermal cycling. In the T/C test, the Al pad and Ti layer between the Si chip and Cu column bumps were displaced due to the accumulation of equivalent plastic strain. The normal plastic strain of the y-direction, $¿_{22},$ was determined to be compressive and was a dominant component in relation to the plastic deformation of Cu/SnAg double-bumps. As the number of thermal cycles increased, normal plastic strains in the perpendicular direction to the Si chip were accumulated on the Cu column bumps at the chip edge in the low temperature region. Thus it was found that displacement failure of the Al pad and Ti layer, the main T/C failure mode of the Cu/SnAg flip-chip assembly, occurred at the Si chip/Cu column interface by compressive normal deformation during thermal cycling. Furthermore, flip chip assemblies with thicker Cu column height showed better T/C reliability. |
| Starting Page | 716 |
| Ending Page | 724 |
| File Size | 9917061 |
| Page Count | 9 |
| File Format | |
| ISBN | 9781424421176 |
| DOI | 10.1109/EPTC.2008.4763517 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Flip chip Assembly Numerical analysis Plastics Failure analysis Capacitive sensors Testing Thermal stresses Finite element methods Temperature |
| Content Type | Text |
| Resource Type | Article |
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