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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Marenco, N. Reinert, W. Warnat, S. Lange, P. Gruenzig, S. Hillmann, G. Kostner, H. Bock, G. Guadagnuolo, S. Conte, A. |
| Copyright Year | 2008 |
| Description | Author affiliation: SAES getters S.p.A, Lainate, Italy (Guadagnuolo, S.; Conte, A.) || Fraunhofer Inst. fur Siliziumtechnologie, Itzehoe, Germany (Marenco, N.; Reinert, W.; Warnat, S.; Lange, P.; Gruenzig, S.) || Datacon Technol. GmbH, Radfeld, Austria (Hillmann, G.; Kostner, H.; Bock, G.) |
| Abstract | Smart inertial sensor systems, e.g. gyroscope clusters, are basically formed by a MEMS device with micromachined structures and an ASIC with drive- and sense-circuits. Integration is moving towards a direct interconnect by chip stacking to form a chip-scale system in a package. As an alternative to a Wafer-to-Wafer bonding approach, a Chip-to-Wafer (C2W) assembly can reduce initial product launch costs and thus target for smaller or more innovative market segments. The present work addresses specific aspects related to particle management, singulation of open MEMS and a two-step C2W bonding approach. A short outlook on additional steps to form a MEMS chip-scale package is provided. |
| Starting Page | 773 |
| Ending Page | 777 |
| File Size | 5077097 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424421176 |
| DOI | 10.1109/EPTC.2008.4763526 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Encapsulation Resonance Micromechanical devices Stacking Application specific integrated circuits Chip scale packaging Wafer bonding Intelligent sensors Sensor systems Gyroscopes |
| Content Type | Text |
| Resource Type | Article |
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