NDLI: Advanced Analysis of WLCSP Copper Interconnect Reliability under Board Level Drop Test

Content Provider	IEEE Xplore Digital Library
Author	Tong Yan Tee Long BinTan Anderson, R. Hun Shen Ng Jim Hee Low Choong Peng Khoo Moody, R. Rogers, B.
Copyright Year	2008
Abstract	The Wafer Level Chip Scale Package (WLCSP) is gaining popularity for its performance and for its ability to meet miniaturization requirements of portable consumer electronics, such as cell phones. Due to differential bending between the silicon die and the PCB and the large stiffness difference, board level drop/bend tests are widely accepted methods to evaluate damage in the parts when a handheld device is dropped by the consumer. Through an aggressive product development program which includes experiment and simulation Amkor has developed the next level of WLCSP $(CSP^{nlTM}),$ a product which exhibits superior board level reliability when subjected to drop impact, a strong requirement for portable electronics. The common industrial qualification criterion is for the product to withstand at least 40 drops before first failure (FF) under the JEDEC drop test condition of 1500 G/0.5 ms. With optimal $CSP^{nl}$ and PCB designs, recent test results show that a typical Amkor $CSP^{nl}$ with a die size of 5.4 mm × 5.4 mm has a minimum failure-free life of over 1000 drops. For an enhanced $CSP^{nl}$ design, first-failure life of 4860 drops. was recorded in actual drop testing. These excellent results imply that much larger die are possible for future $CSP^{nl}$ products, opening the door for wider applications of WLCSP devices, e.g. in next-generation portable electronics with greater function integration.
Starting Page	1086
Ending Page	1095
File Size	12010960
Page Count	10
File Format	PDF
ISBN	9781424421176
DOI	10.1109/EPTC.2008.4763574
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-12-09
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Life testing Chip scale packaging Electronics packaging Wafer scale integration Consumer electronics Cellular phones Silicon Handheld computers Product development
Content Type	Text
Resource Type	Article

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