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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Sosiati, H. Hirokado, N. Kuwano, N. Ohno, Y. |
| Copyright Year | 2008 |
| Description | Author affiliation: IIS, Univ. of Tokyo, Tokyo, Japan (Ohno, Y.) || Interdiscipl. Grad. Sch. of Eng. Sci., Kyushu Univ., Fukuoka, Japan (Hirokado, N.) || Sci. & Technol. Center for Cooperative Res., Kyushu Univ., Fukuoka, Japan (Kuwano, N.) || Res. Lab. for High Voltage Electron Microscopy, Kyushu Univ., Fukuoka, Japan (Sosiati, H.) |
| Abstract | The present work is devoted to characterize the microstructures of Sn/Cu lead-frame attached on the printed circuit board (PCB) and of tin-whiskers formed on the Sn-surface after exposure under 85°C/85 %RH for 1000 and 2000 h in order to verify the whisker-growth behavior. Whiskers were observed on the un-corroded and corroded Sn-surfaces and confirmed to be of Sn ß-phase. The number of whiskers was relatively small. Within the corroded area Sn was oxidized to be $SnO_{2}.$ The $SnO_{2}$ domain is made of nanocrystalline grains about 10-20 nm in size for specimen exposed for 1000 h, whereas in another one exposed for 2000 h an amorphous phase is included in the $SnO_{2}$ domain. Intermetallic compound (IMC) of $Cu_{3}Sn$ and $Cu_{6}Sn_{5}$ is formed at the Sn/Cu interface. The results suggest that there is competitive stress generation according to formation of the Cu-Sn IMC and the Sn-oxide phase during oxidation and corrosion process. The stress-driven diffusion of Sn-atoms from the higher-stress area into the lower-stress area to form whiskers is discussed. |
| Starting Page | 1054 |
| Ending Page | 1059 |
| File Size | 4156922 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424421176 |
| DOI | 10.1109/EPTC.2008.4763569 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Tin Transmission electron microscopy Temperature Humidity Microstructure Lead Printed circuits Amorphous materials Intermetallic Stress TEM Sn/Cu lead-frame oxidation tin-whisker microstructure |
| Content Type | Text |
| Resource Type | Article |
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