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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lihua Qi Jihua Huang Xingke Zhao Hua Zhang |
| Copyright Year | 2008 |
| Description | Author affiliation: Sch. of Mater. Sci. & Technol., Univ. of Sci. & Technol. Beijing, Beijing, China (Lihua Qi; Jihua Huang; Xingke Zhao; Hua Zhang) |
| Abstract | The changes of morphology and growth tropism of inter-metallic compound (IMC) and IMC growth rate at lead-free solders/Cu interface of solder joints often limit the reliability of the entire package during service. Furthermore, during thermal-shearing cycling process, the thickness of IMC at the interface grows significantly and growth tropism of IMC changes, resulting in in-service evolution of the fatigue behavior. In this paper, the growth mechanism and tropism Of $Cu_{6}Sn_{5}$ at Sn3.5Ag0.5Cu/Cu interface are studied. It can be found that the results are correlated with shear stress-strain from the solder subjected to thermal-shearing cycling conditions. The average diffusion coefficient of IMC is from $10^{-5}$ $¿m^{2}/s$ to $10^{-4}$ $¿m^{2}/s.$ The IMC growth follows parabola growth kinetics, implying that the IMC growth is controlled by atomic diffusion. |
| Starting Page | 499 |
| Ending Page | 505 |
| File Size | 7002053 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781424421176 |
| DOI | 10.1109/EPTC.2008.4763483 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal stresses Copper Microstructure Soldering Temperature Thermal expansion Tungsten Aging Materials science and technology Environmentally friendly manufacturing techniques thermal-shearing cycling inter-metallic compound (IMC) diffusion coefficient growth tropism |
| Content Type | Text |
| Resource Type | Article |
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