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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chee Houe Khong Xiaowu Zhang Kripesh, V. Lau, J.H. Dim-Lee Kwong Sundaram, V. Tummula, R.R. Meyer-Berg, G. |
| Copyright Year | 2008 |
| Description | Author affiliation: Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA (Sundaram, V.; Tummula, R.R.) || Infineon Technol. AG, Munich (Meyer-Berg, G.) || Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore (Chee Houe Khong; Xiaowu Zhang; Kripesh, V.; Lau, J.H.; Dim-Lee Kwong) |
| Abstract | The effect of thinning down the chip thickness, will affect the stress pattern in the chip and causes the chip to deform locally when the thickness of the chip is thinner than a certain critical value. Such a local deformation may cause sharp gradient of residual stress around the solder bumps and thus, various failures. This paper shows that by considering the effect of solder bumps on a 50 mum chip, the stress magnitude increases by almost double. In addition, the normal stress $(sigma_{x})$ in the 50 mum chip is increased by 94% with increasing coefficient of thermal expansion of the embedded material properties. By moving the same 50 mum chip on top surface along the diagonal and side of the BT substrate, it is observed that the stress in the chip remains unchanged. Finally both the shape of parallelogram and square 50 mum chip have a lower stress magnitude as compared to other shapes. |
| Starting Page | 236 |
| Ending Page | 241 |
| File Size | 6125204 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424421176 |
| DOI | 10.1109/EPTC.2008.4763440 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-12-09 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal stresses Packaging Space technology Residual stresses Microelectronics Thermal expansion Shape Substrates Dielectric materials Material properties |
| Content Type | Text |
| Resource Type | Article |
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