Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lannon, J. Hilton, A. Huffman, A. Lueck, M. Vick, E. Goodwin, S. Cunningham, G. Malta, D. Gregory, C. Temple, D. |
| Copyright Year | 2012 |
| Description | Author affiliation: RTI International, Research Triangle Park, NC (Lannon, J.; Hilton, A.; Huffman, A.; Lueck, M.; Vick, E.; Goodwin, S.; Cunningham, G.; Malta, D.; Gregory, C.; Temple, D.) |
| Abstract | Two 3D Si interposer demonstration vehicles containing through-Si vias (TSVs) were successfully fabricated using integration of two different TSV formation and multilevel metallization (MLM) process modules. The first Si interposer vehicles were made with a dual damascene frontside MLM (5 levels), backside TSV (unfilled, vias-last), and backside metallization (2 levels) process sequence on standard thickness 6” wafers. The front-side MLM was comprised of 4 metal routing layers (2 μm Cu with 2 μm oxide interlayer dielectric) and 1 metal pad layer. Electrical yield as high as 100% was obtained on contact chain test structures containing 26,400 vias between the front-side MLM layers, while the average contact resistance between the dual damascene levels was < 4 MΩ per via. TSV dimensions of 100 and 80 μm diameter and 6:1 aspect ratio were investigated. DRIE bottom clear process conditions were optimized for each via dimension to produce 100% yield on TSV contact chains with up to 540 vias. The optimized DRIE conditions also resulted in TSV resistance below 30 MΩ and sufficient TSV isolation resistance (>100MΩ/via at 3.3V) for the target application. Functional testing of two die (4 cm × 3.7 cm die size) showed that 99% of the functional circuit path nets had acceptable continuity and isolation. The second Si interposer vehicles were fabricated using a vias-first TSV (filled, blind vias), wafer-level packaging (WLP) front-side MLM (2 levels), wafer thinning (via reveal), and WLP-MLM (1 level) process sequence on stock 6” wafers. Via dimensions for the viasfirst interposers were 50 μm diameter × 315 μm depth or 80 μm diameter × 315 μm depth (6:1 or 4:1 aspect ratios). The front and backside MLM was formed with a 2 μm Cu routing layer and one of two spin-on dielectrics (polyimide or ALX) for evaluation of polymer dielectric process compatibility with Cu-filled TSVs and thinned wafer processing. Details of the process modules and process integration required to realize the TSV Si interposers are described. |
| Starting Page | 268 |
| Ending Page | 273 |
| File Size | 880061 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248839 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Through-silicon vias Silicon Vehicles Metallization Routing Passivation |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|