Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Souriau, J.-C. Castagne, L. Liotard, J. Inal, K. Mazuir, J. Le Texier, F. Fresquet, G. Varvara, M. Launay, N. Dubois, B. Malia, T. |
| Copyright Year | 2012 |
| Description | Author affiliation: ENSM.SE/CMP-GC - PS2 departement, Gardanne, France (Inal, K.; Mazuir, J.; Le Texier, F.) || ST-Microelectronics, 190 Avenue Célestin Coq, Zone Industrielle, 13106 Rousset Cedex, France (Liotard, J.) || SPTS Technologie sas., 4 avenue Pré de Challes, 74940 Annecy-le-Vieux, France (Varvara, M.; Launay, N.) || Hardware Security Research Group, Gemalto, 880 avenue de Mimet 13541 Gardanne, France (Dubois, B.; Malia, T.) || CEA, LETI, MINATEC Campus, 17 rue des Martyrs, 38054 GRENOBLE Cedex 9, France (Souriau, J.-C.; Castagne, L.) || Fogale, 125 rue de l'Hostellerie, Ville Active, Bât A-Parc Acti+, 30900 Nimes, France (Fresquet, G.) |
| Abstract | This paper is dedicated to the full development of several technological modules mandatory for 3-D multiple die stacking. This includes technologies such as thinning, Through Silicon Vias (TSV) and dies interconnection. A via last approach was chosen to be compatible with die integration coming from various foundries where design, die thickness and contact pad metallurgy are predefined. The interconnection between each die is based on chip on wafer bonding and micro-inserts technology. Small spikes of Ni are formed at the interconnection point between the two circuits. The approach allows a very narrow connection (less than 10 μm of interface) and do not necessitate an underfill. A test vehicle which allows characterizing the required technologies has been designed and manufactured. It consists of 50 μm thick dies including TSV and contact lines on both sides. These dies are stacked on silicon interconnection network enabling to extract electrical signal. The electrical continuity through the stacking was tested from the substrate thanks to Daisy Chain. Finally, these technologies were implemented in a SimCard prototype. The test vehicle and final prototype will be fully described in this paper. A technical focus will be done on the most important process steps for the 3D integration which include vias last integration, micro-bumping and thin die stacking. Several electrical Kelvin structures were measured from the substrate to estimate the contact resistance through micro-inserts and TSV and results will be presented and commented. |
| Starting Page | 1047 |
| Ending Page | 1053 |
| File Size | 1780271 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248965 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Through-silicon vias Vehicles Stacking Electrical resistance measurement Substrates Metals Resistance |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|