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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Amagai, M. Seungmin, J. |
| Copyright Year | 2012 |
| Description | Author affiliation: Modeling Group, TMG Japan, Texas Instruments, 2350 Kihara, Miho-mura, Inashiki-gun, 300-0496, Japan (Amagai, M.; Seungmin, J.) |
| Abstract | Recently, drop test reliability has become a major concern for mobile electronic products. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased stress in solder joints during drop impacts due to their complicate structures. In this study, evaluations of test board material properties, damping parameters, the correlation of displacements and strains between model and drop test and also parameters of fail cyclic life prediction were performed with three point bend tests, acceleration sensors, strain gauges, a high speed camera, drop testers, dynamic finite element models. |
| Starting Page | 55 |
| Ending Page | 61 |
| File Size | 1052055 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248806 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Strain Springs Damping Rubber Acceleration Fasteners Correlation |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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