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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ziyin Lin Yagang Yao Mcnamara, A. Kyoung-sik Moon Wong, C.P. |
| Copyright Year | 2012 |
| Description | Author affiliation: School of Mechanical Engineering, Georgia Institute of Technology 771 Ferst Drive, Atlanta, GA, USA 30332 (Mcnamara, A.) || School of Materials Science and Engineering, Georgia Institute of Technology 771 Ferst Drive, Atlanta, GA, USA 30332 (Ziyin Lin; Yagang Yao; Kyoung-sik Moon; Wong, C.P.) |
| Abstract | Thermal management in 3D packaging plays an important role in the device performance and reliability. The development of thermally conductive underfills is highly crucial, but still challenging. In this work, single/few-layer boron nitride (BN) was exfoliated from bulk h-BN flakes and was incorporated into epoxy resin via a solvent transfer method.[1] The structure of exfoliated BN was characterized by varieties of techniques, including scanning electron microscopy, transmission electron microscopy, electron diffraction, Raman microscopy, and UV-vis microscopy. The single/few layer boron nitride/epoxy composite was characterized by thermomechanical analysis and thermogravimetric analysis. The thermal conductivity of exfoliated BN was measured by an infrared thermal imaging method. A significant enhancement of thermal conductivity (220 %) is observed at a low filler loading of 5 wt%, indicating that the single/few-layer BN is a promising filler for the development of novel underfill for 3D packaging. |
| Starting Page | 1437 |
| Ending Page | 1441 |
| File Size | 1685986 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6249025 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Thermal conductivity Conductivity Electronic packaging thermal management Materials Heating Loading Thermal loading |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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