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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ji-Won Shin Yong-Won Choi Young Soon Kim Un Byung Kang Young Kun Jee Ji Hwan Hwang Kyung-Wook Paik |
| Copyright Year | 2012 |
| Description | Author affiliation: Package Development team, Semiconductor R&D Center, Semiconductor Business, Samsung Electronics Co., Ltd (Un Byung Kang; Young Kun Jee; Ji Hwan Hwang) || Dept. of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST) (Ji-Won Shin; Yong-Won Choi; Young Soon Kim; Kyung-Wook Paik) |
| Abstract | Methyl tetrahydrophthalic anhydride (MeTHPA), and Methyl hexahydrophthalic anhydride (MeHHPA) were added as curing agent for bisphenol A/phenoxy resin-based non-conductive film (NCF). Only NCF with MeTHPA showed thermal stability and void-less interface at 250°C, and addition of 0.5 wt% of latent curing accelerator showed minimum NCF cure at pre-bonding stage (120°C) and full NCF cure after main-bonding stage (250°C). The formulated NCF were applied to TSV chip on substrate bonding with Cu/Sn-Ag double bump to Cu pad joint structure. Film thickness and bonding pressure were optimized at 15 μm and 2.4 MPa to form state-of-art joint structure with optimal fillet shape. The joint structures were observed to be stable even after three reliability tests: high temperature storage test (HTST) of 200 hours, pressure cooker test (PCT) of 24 hours, and thermal cycle (T/C) of 200 cycles. Anhydride-based NCF showed stable joints due to flux-ability of anhydride; however, conventional dicyan diamide (DICY) based NCF showed broken joints after T/C due to lack of flux-ability. |
| Starting Page | 31 |
| Ending Page | 35 |
| File Size | 2060408 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248802 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Curing Bonding Joints Through-silicon vias Reliability Resins Films |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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