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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Honda, K. Nagai, A. Satou, M. Hagiwara, S. Tuchida, S. Abe, H. |
| Copyright Year | 2012 |
| Description | Author affiliation: Hitachi Chemical Co., Ltd. R&D Div. Telecommunication Materials Development Center 48 Wadai, Tsukuba-shi Ibaraki, 300-4247, Japan (Honda, K.; Nagai, A.; Satou, M.; Hagiwara, S.; Tuchida, S.; Abe, H.) |
| Abstract | For higher density electronic package including 3D-package, we developed a novel NCF (Non Conductive Film) support for the pre-applied process that connects and underfills a chip simultaneously. We modified the base film, filler size and others and improved the ability in lamination and BG (back grinding), transparency and dicing to get the excellent processability before the bonding. We also optimized the viscosity and added the remarkably effective flux agent (organic acid) into the NCF to improve the bondability. These properties made it possible to form the excellent Cu-solder bonding parts in short time (<5 s) without void. For the reliability, we discovered the adequate flux agent (organic acid) which considerably can suppress the decreasing of the adhesive strength after moisture absorption treatment to the extent enough to pass the Lv2/reflow test of molded PKG. We also evaluated the processability and reliability of the pseudo 3D package using this NCF, and obtained the result of the ability to sustain the chip stack and pass the Lv2/reflow test after molding PKG. From these features, this novel NCF is expected to be a promising material for the 3D package with TSV (Through Silicon Via) [1–3]. |
| Starting Page | 385 |
| Ending Page | 392 |
| File Size | 2146991 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248859 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Bonding Viscosity Substrates Lamination Films Adhesive strength Moisture |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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