Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Huili Xu Woong Ho Bang Tae-Kyu Lee Choong-Un Kim |
| Copyright Year | 2012 |
| Description | Author affiliation: Interconnect Technology Team (Manufacturing Technology Group), Cisco System Inc., 170 West Tasman Drive, SJC-D-2, San Jose, CA 95134 (Tae-Kyu Lee) || Department of Materials Science and Engineering, University of Texas at Arlington, 500 West First Street, Box 19031, Arlington, Texas 76019 (Huili Xu; Woong Ho Bang; Choong-Un Kim) |
| Abstract | This paper reports experimental evidences suggesting that fracture resistance of solder joints in packaging assembly is not necessarily uniform but can vary significantly with their locations in the assembly. Specifically, it is found that the solder joints located at the chip corner is much more prone to the fracture under thermo-mechanical or mechanical loads such as vibration and shock. This, the variation in fracture resistance, is found from the isothermal cyclic shear fatigue testing of 60Pb-40Sn, SAC305 and SAC105 solder alloys assembled in PBGA configuration. Under pure shear fatigue situation, the location of the joint failure should ideally be random because all joints are subjected to an identical shear strain. However, it is found that the solder joint that fails first is always the ones located at the corner site of chip. The inner joint, close to the center of the chip, shows much higher resistance against failure. Further study that investigates the joint microstructure with aging, produces evidences indicating that the corner is the place of high residual thermal stress or stored strain energy (by plastic deformation during cooling or heating). In an extreme case, where stored energy by plastic deformation is not released well by competing process, the stored energy triggers recrystallization, leading to polygranular structure of the corner joint solder. These results strongly suggest that the joints in package assembly have different reliability and microstructural evolution path depending on their location in the package and thermal history. |
| Starting Page | 500 |
| Ending Page | 504 |
| File Size | 932881 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248877 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Joints Fatigue Strain Microstructure Cooling recrystallization shear fatigue thermal strain lead free solder |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|