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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jian-Yu Shih Yen-Chi Chen Cheng-Hao Chiang Chih-Hung Chiu Yu-Chen Hu Chung-Lun Lo Chi-Chung Chang Kuan-Neng Chen |
| Copyright Year | 2013 |
| Description | Author affiliation: Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan (Jian-Yu Shih; Cheng-Hao Chiang; Yu-Chen Hu; Kuan-Neng Chen) || TXC Corp., Taoyuan, Taiwan (Yen-Chi Chen; Chih-Hung Chiu; Chung-Lun Lo; Chi-Chung Chang) |
| Abstract | In this paper, one novel packaging approach for crystal resonator with the quartz crystal is demonstrated, developed and characterized. The proposed crystal resonator of the novel package adopts several 3-D core technologies, such as Cu TSVs, thin-film Cu/Sn eutectic bonding, and wafer thinning. A 1210 crystal resonator with quartz blank mount is successfully developed with Cu TSVs that enables the electrical connection of the signal electrode on the quartz blank. The quartz blank is protected by the simultaneous formation of strength reinforcement and excellent sealing capacity of thin-film Cu/Sn eutectic bonding. With the well fabrication and the enhanced structure, excellent leakage results in the MIL-STD-883 hermetic test $(8.5*10^{-9}$ $~1*10^{-8}$ Pa $m^{3}/sec$ by He leak detector) show the crystal resonator using 3D integration has the great performance and manufacturability to replace the conventional metal or ceramic enclosures for the next generation products. |
| Sponsorship | IEEE Components, Packaging Manuf. Technol. Soc. |
| Starting Page | 599 |
| Ending Page | 604 |
| File Size | 1211621 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479902330 |
| ISSN | 05695503 |
| e-ISBN | 9781479902323 |
| DOI | 10.1109/ECTC.2013.6575635 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-05-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Crystals Through-silicon vias Silicon Cavity resonators Bonding Tin |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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