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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Duch, S. Krebs, T. Loewer, Y. Schmitt, W. Thomas, M. |
| Copyright Year | 2012 |
| Description | Author affiliation: Heraeus Materials Technology GmbH & Co. KG, Contact Material Division, Heraeusstraße 12 - 14, 63450 Hanau - Germany (Duch, S.; Krebs, T.; Loewer, Y.; Schmitt, W.; Thomas, M.) |
| Abstract | Power semiconductor modules are used in a wide field of applications and power ranges. Two common trends for these devices are miniaturization and cost reduction, leading to new requirements for dies, substrates and interconnect materials. As a result, the power density and therefore the operation temperature in the devices rise, creating the need for new interconnect materials. These materials must have high thermal and electrical conductivity to ensure excellent heat dissipation and thermo-mechanical stability. Consequently, the device operation temperature, which is currently limited to maximum 150°C, can be increased and the reliability of the module can be improved. The novel mAgic sinter materials feature highest thermal and electrical conductivity and can be used for operation temperatures above 150°C. This new material family provides a solution to reduce size and cost of high power semiconductor modules and, at the same time, improves the overall performance and reliability of these packages. |
| Starting Page | 416 |
| Ending Page | 422 |
| File Size | 2785382 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248864 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Heating Substrates Microassembly Soldering Silver Joints |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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