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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tseshih Sung Chiang, K. Lee, D. Ma, M. |
| Copyright Year | 2012 |
| Description | Author affiliation: Siliconware Precision Industries Co., Ltd, No. 153, Sec. 3, Chung Shan Rd., Tantzu, Taichung, Taiwan 427, R.O.C. (Tseshih Sung; Chiang, K.; Lee, D.; Ma, M.) |
| Abstract | As the progress of the packaging technology for the electronic consuming devices, the customer demands more and more. From the trend of the development on electronic devices, it shows that these demands require for more functions or higher density of devices within a limited space. By the capabilities of the 3D-IC technology, it could support such a design with multi-purposes including a smaller size, the high-speed and multi-functions. There are many approaches and technologies to make the 3D-IC. Amount of them, the stacking with Through-Silicon-Via (TSV), plays a very important role. It shortens the path of the circuit in a device. And hence, this device may support a faster operation. In this study, we analyze the different designs based on two TSV technologies, the Cu-filled and coaxial-type TSVs. By using the simulation approach, we evaluate the performances of these proposed designs. And, the results in our study should have the benefits for designing the interposer substrates which are used for developing the 3D-IC. |
| Starting Page | 865 |
| Ending Page | 870 |
| File Size | 1109321 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6248935 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Through-silicon vias Impedance Silicon Analytical models Copper Integrated circuit interconnections Scattering parameters |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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