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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Shuangxi Sun Luo Xin Zanden, C. Carlberg, B. Lilei Ye Johan Liu |
| Copyright Year | 2012 |
| Description | Author affiliation: Key State Laboratory for New Displays & System Applications and SMIT Center, Shanghai University, Box 282, Yanchang Road 149, Shanghai 200072, P.R. China (Shuangxi Sun; Luo Xin; Johan Liu) || SHT Smart High-Tech AB, Fysikgränd 3, Se 412 96 Göteborg, Sweden (Lilei Ye) || SMIT Center and BioNano Systems Laboratory, Department of Microtechnology and Nanoscience (MC2), Chalmers University of Technology, SE-412 96, Göteborg, Sweden (Zanden, C.; Carlberg, B.) |
| Abstract | The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. A novel Nano-TIM was developed to improve the heat dissipation of electronics packaging. This paper aims at studying the heat dissipation performance of a new class of nano-structured polymer-metal composite film (Nano-TIM) after power cycling. The new Nano-TIM uses metal to provide continuous thermal pathways while using nano-polymer to control the elasticity of the TIM. Through semiconductor processing and RTD principle, chips including 5∗5, 10∗10, 20∗20, 30∗30 $(mm^{2}),$ were developed to study different size's influence on heat dissipation effect of the Nano-TIM. Additional parameters studied include power effect. RTD is used respectively to measure the junction temperature, and then the RthJC (Junction-to-Case Thermal Resistance) is calculated afterwards. The Transient thermal resistances of the Nano-TIM were also tested by T3Ster method to further study heat dissipation effect of Nano-TIM. The morphologies and interaction between the Nano-TIM and chips were carefully studied using X-ray Scanning Microscope to analyze heat flow path. The result shows that Nano-TIMs can be used to 30 mm in chip length as the thermal interface material. |
| Starting Page | 1426 |
| Ending Page | 1430 |
| File Size | 1502321 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467319669 |
| ISSN | 05695503 |
| e-ISBN | 9781467319652 |
| e-ISBN | 9781467319645 |
| DOI | 10.1109/ECTC.2012.6249023 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-05-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Materials Heating Temperature measurement Thermal resistance Microassembly Junctions Temperature sensors |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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