NDLI: Thermal conductivity influence in SMT reflow soldering process

Content Provider	IEEE Xplore Digital Library
Author	Svasta, P. Simion-Zanescu, D. Willi, C.
Copyright Year	2002
Description	Author affiliation: Center of Technol. Electron. & Interconnection Techniques, Politehnica Univ. of Bucharest, Romania (Svasta, P.; Simion-Zanescu, D.; Willi, C.)
Abstract	One of the most used soldering processes for SMD components is the reflow process. For the PCBs one should expect the increasing of the components density and interconnection density together with the continuous reducing of component size and weight. It is well known how important it is for a proper soldering process to have the temperature distribution on the junction point between component pins and the corresponding pads. Mainly convection and radiation realize the temperature distribution in the reflow oven. Usual thermal conduction is treated to study the dissipation characteristics from a structure to the environment. In case of SMT assembly it is reversed, the influence of inside environment of a reflow oven acts on the assembled structure. The way of heat transfer and physical properties of the subassemblies are very important to obtain reliable product; "zero defects". The paper has two main goals. First, to present a simple method to realize a map of heaters according with the oven's geometrical profile. This is necessary for mathematical modeling, computing and/or simulation. In the second part this method will be emphasized.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	1613
Ending Page	1616
File Size	398780
Page Count	4
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008322
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Surface-mount technology Reflow soldering Ovens Temperature distribution Assembly Pins Heat transfer Mathematical model Computational modeling
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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