NDLI: Online-offline laser ultrasonic quality inspection tool for multi-layer chip capacitors

Content Provider	IEEE Xplore Digital Library
Author	Erdahl, D.S. Ume, I.C.
Copyright Year	2002
Description	Author affiliation: George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Erdahl, D.S.; Ume, I.C.)
Abstract	The advent of surface mounted devices has allowed continued size decreases in electronic packages. However, the decrease in device size has led to other manufacturing problems. Therefore, as devices decrease in size, inspection technology must be developed to maintain consistent levels of quality without increasing manufacturing process time. The focus of most inspection technology is on finding defects with solder joint interconnects, but some devices, such as multi- layer chip capacitors (MLCCs), have failures not relating to the solder connection. Defects in MLCCs, known as flex cracks, are commonly caused by manufacturing processes, and no current means of detection exists, unless the cracks cause a device to fail a functional test. A laser ultrasonic and interferometric system, providing a non-contact, nondestructive and online approach for microelectronic package quality inspection, is designed and presented. A pulsed infrared laser excites a specimen into vibration through laser-generated ultrasound, and the vibration displacement is measured using an interferometer. Differentiation between acceptable and unacceptable devices is achieved using signal-processing techniques that compare waveforms between two devices. Results are presented or a case study involving MLCCs that have intentionally induced flex cracks, causing the devices to fail. The system has the capability of detecting open connections and flex cracks in the MLCC packages.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	225
Ending Page	231
File Size	851000
Page Count	7
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008098
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Inspection Capacitors Vibration measurement Manufacturing processes Pulse measurements Electronics packaging Soldering Testing Microelectronics Optical design
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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