NDLI: An energy-based method to predict delamination in electronic packaging

Content Provider	IEEE Xplore Digital Library
Author	Fan, H.B. Chung, P.W.K. Yuen, M.M.F. Chan, P.C.H.
Copyright Year	2002
Description	Author affiliation: Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China (Fan, H.B.; Chung, P.W.K.; Yuen, M.M.F.)
Abstract	The propensity and significance of interfacial delamination as a crucial failure mechanism in electronic packaging have been well documented in many papers. Many of the failure criteria were used to solve 2-dimensional problem with a pre-crack. However, in real electronic packages, the size and location of the cracks or/and delamination cannot be predicted. It is not easy to use the traditional fracture criteria to deal with more complicated 3-D delamination problems. The potential delamination interface of copper leadframe/Epoxy Molding Compound (EMC) was selected in the study. The stresses of the interface were evaluated by the Button Shear Test. A series of Button Shear Tests was conducted to evaluate the adhesion properties of Epoxy Molding Compounds (EMCs) on copper substrate. In each of the tests, the critical load acting on the EMC of the button shear sample was measured at different shear angles and a finite element model was used to evaluate the stresses at the interface between the mold compound and the copper substrate. In this paper, an energy-based method is proposed by deriving the energy to initiate each of the tensile and shear modes of failure across the interfaces of the button shear test samples for the chosen EMC/leadframe material system. Component stresses were extracted from the numerical simulation in order to compute the distortional strain energy density, (U/sub d/), and the hydrostatic strain energy density, (U/sub h/), relating respectively to the shear and tensile mode. (U/sub d/) and (U/sub h/) were calculated from the Young's modulus of EMC and the average stresses within a selected region of the finite element model where it exhibits high stress values.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	834
Ending Page	838
File Size	485493
Page Count	5
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008197
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Delamination Electronics packaging Tensile stress Electromagnetic compatibility Copper Testing Finite element methods Tensile strain Failure analysis Adhesives
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A multiscale method to predict delamination in Cu-epoxy systems in electronic packages

A new method to predict delamination in electronic packages

Prediction of delamination in a Bi-material system based on free-edge energy evaluation

Delamination control in electronic packaging using the energy method

Energy based failure criterion for interfacial delamination [IC packaging]

A method for evaluating delamination between epoxy moulding compounds and different plated leadframes

Moisture diffusion study in electronic packaging using molecular dynamic simulation

Mechanism of Adhesive Film Popcorn in Electronic Packaging

Package structural integrity analysis considering moisture

An energy-based method to predict delamination in electronic packaging

Similar Documents

A multiscale method to predict delamination in Cu-epoxy systems in electronic packages

A new method to predict delamination in electronic packages

Prediction of delamination in a Bi-material system based on free-edge energy evaluation

Delamination control in electronic packaging using the energy method

Energy based failure criterion for interfacial delamination [IC packaging]

A method for evaluating delamination between epoxy moulding compounds and different plated leadframes

Moisture diffusion study in electronic packaging using molecular dynamic simulation

Mechanism of Adhesive Film Popcorn in Electronic Packaging

Package structural integrity analysis considering moisture

An energy-based method to predict delamination in electronic packaging