NDLI: Modeling and characterization of wire bonding for RF applications

Content Provider	IEEE Xplore Digital Library
Author	Lu, A.C.W. Wei Fan Wai, L.L. Low, L.A. Ke, F.X. Yip, K.C. Lim, Y.P.
Copyright Year	2002
Description	Author affiliation: Electron. Packaging Dept., Gintic Inst. of Manuf. Technol., Singapore, Singapore (Lu, A.C.W.; Wei Fan; Wai, L.L.)
Abstract	This paper describes a design methodology for improving the electrical performance of wire bonding. Adjacent power or ground wires are used to provide return paths in a coplanar configuration, thereby minimizing impedance mismatch. Design space exploration based on full-wave electromagnetic analysis is performed to achieve an optimized topology. The methodology has been demonstrated for both parallel and fanout bonding topologies for high frequencies up to 10 GHz. With advances in wire bonding technology, particularly fine pitch bonding, a coplanar configuration is highly feasible. The proposed methodology can be applied to lead frame, leadless chip carrier, COB and advanced BGA packages.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	905
Ending Page	909
File Size	328242
Page Count	5
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008207
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wire Bonding Radio frequency Topology Design methodology Impedance Space exploration Electromagnetic analysis Design optimization Space technology
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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