NDLI: Neural network modeling of variable frequency microwave curing

Content Provider	IEEE Xplore Digital Library
Author	Davis, C. Tanikella, R. Kohl, P. May, G.
Copyright Year	2002
Description	Author affiliation: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Davis, C.)
Abstract	A new thermal processing technique, known as variable frequency microwave (VFM) curing, can perform the same processing as traditional thermal curing in minutes without compromising the intrinsic material properties. To verify that VFM curing results in comparable material properties, several experiments are performed with samples of benzocyclobutene (BCB) cured on silicon wafers. Curing is performed in a Lambda Technologies MircoCure/spl trade/ 2100 system, as well as a conventional thermal furnace. The BCB samples are heated to an appropriate temperature and held at that temperature for a specific amount of time for both processing methods. Through-plane and in-plane indices of refraction are subsequently measured using a Metricon prism coupler. Backpropagation neural networks are then implemented to model the VFM curing and the conventional curing processes. Inputs to these neural networks are temperature and time-at-temperature, and the outputs are the in-plane and through-plane indices of refraction of the cured BCB samples. The indices of refraction are then used as metrics to determine the extent of cure of the BCB. To validate the neural network models, the root-mean-square (RMS) error is used as a performance metric. RMS errors on the order of 1e-2 are achieved when comparing the outputs of the neural network models with test data.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	931
Ending Page	935
File Size	593622
Page Count	5
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008212
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Neural networks Frequency Curing Temperature Electromagnetic heating Material properties Microwave theory and techniques Silicon Furnaces Backpropagation
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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