NDLI: Effect of lead-free BGA rework on joint microstructure and intermetallic compound formation

Content Provider	IEEE Xplore Digital Library
Author	Horsley, R.M. Ekere, N.N. Salam, B.
Copyright Year	2002
Description	Author affiliation: Manuf. Technol. Group, Celestica Ltd., Kidsgrove, UK (Horsley, R.M.)
Abstract	The last five years has seen a massive increase in area array type packages such as the ball grid array (BGA) and the chip scale package (CSP). Improvements in performance and yield, achieved by the greater interconnect density of this packaging format, have been responsible. However, one of the key challenges in using area array type packages such as the BGA, are the difficulties associated with inspecting and reworking the array type interconnects. In practice, a solder joint repair can only be affected by removal of the whole device and then replacement with a new device. Although there are numerous reports on lead-free soldering, investigating various alloy systems and other aspects of the soldering process reports on the effect of lead-free BGA rework are very scarce. In particular, there is very little documented regarding the combination of rework processes and the use of lead-free materials and their resultant effect on solder joint metallurgy and mechanical performance. We report on the investigation of a lead-free BGA rework technique. Two PCB pad-cleaning methods (solder wicking and hot air de-soldering) were investigated to assess their impact on the joint microstructure and the intermetallic compound formation.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	1497
Ending Page	1501
File Size	1219776
Page Count	5
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008304
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Microstructure Intermetallic Lead Soldering Chip scale packaging Legislation Assembly Consumer electronics Europe
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Rework and reliability of QFP and BGA lead-free assemblies

Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation

Reliability and Au embrittlement of lead free solders for BGA applications

Relationship of tensile interfacial strength to lead-free BGA impact performance

The status of lead-free solder alloys

Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA)

Board-level reliability of lead-free SnAgCu solder joint

Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint

Automatic and Secure Rework in a Lead-Free Environment

Effect of lead-free BGA rework on joint microstructure and intermetallic compound formation

Similar Documents

Rework and reliability of QFP and BGA lead-free assemblies

Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation

Reliability and Au embrittlement of lead free solders for BGA applications

Relationship of tensile interfacial strength to lead-free BGA impact performance

The status of lead-free solder alloys

Performance assessment on board-level drop reliability for chip scale packages (fine-pitch BGA)

Board-level reliability of lead-free SnAgCu solder joint

Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint

Automatic and Secure Rework in a Lead-Free Environment

Effect of lead-free BGA rework on joint microstructure and intermetallic compound formation