NDLI: Digital and RF integration in system-on-a-package (SOP)

Content Provider	IEEE Xplore Digital Library
Author	Sundaram, V. Fuhan Liu Dalmia, S. Hobbs, J. Matoglu, E. Davis, M. Nonaka, T. Laskar, J. Swaminathan, M. White, G.E. Tummala, R.R.
Copyright Year	2002
Description	Author affiliation: Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA (Sundaram, V.; Fuhan Liu; Dalmia, S.; Hobbs, J.; Matoglu, E.; Davis, M.)
Abstract	The Packaging Research Center (PRC) is developing system-on-a-package (SOP) technology, as a complimentary alternative to SOC, as the fundamental building block for next generation convergent systems with computing, telecom and consumer capabilities with data and voice. Any systems of this nature have to provide not only high-speed digital, but also high bandwidth optical, analog, RF and perhaps MEMS functions. The SOP technology being pursued at PRC with embedded digital, optical and RF functions addresses this need, optimizing the IC and the package for functions, performance, cost, size and reliability. The PRC is developing this complimentary alternative to SOC using a three tier strategy consisting of fundamental research innovations, enabling technology developments and system-level testbeds. Individual digital, optical and RF testbeds have been developed to enable the integration of novel packaging technologies like embedded passive and optical components, high density global interconnections and wafer level flip-chip assembly. A phased system testbed is being evolved from these three testbeds to develop new SOP convergent system platforms for a digital/optical/RF system implementation. This paper summarizes the latest PRC accomplishments in the development of SOP baseline processes and system testbeds and updates the progress from basic research and technology integration to system testbeds for SOP.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	646
Ending Page	650
File Size	714246
Page Count	5
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008164
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency System testing Partial response channels High speed optical techniques Packaging Optical devices Optical interconnections Telecommunication computing Bandwidth Micromechanical devices
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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