NDLI: Effects of reflow conditions on the formation of Au-Ni-Sn compounds at the interface of Au-Pb-Sn and Au-Sn solder joints with Ni substrate

Content Provider	IEEE Xplore Digital Library
Author	Kinyanjui, R.K. Zribi, A. Cotts, E.J.
Copyright Year	2002
Description	Author affiliation: Dept. of Phys., State Univ. of New York, Binghamton, NY, USA (Kinyanjui, R.K.; Zribi, A.; Cotts, E.J.)
Abstract	We investigated the effect of reflow conditions (temperature and time above the liquidus temperature) on the growth, morphology and location of the ternary (Au,Ni)Sn/sub 4/ phase in joints made with Ni or Au/Ni substrates. We considered joints created with Au/sub 0.1/Sn/sub 99.9/ or Au/sub 0.1/Pb/sub 26/Sn/sub 73.9/ solders reflowed on Ni substrates, and Sn/sub 94.35/Ag/sub 3.8/Cu/sub 1.85/ solder reflowed on Au/Ni metallization. The Au/sub 0.1/Pb/sub 26/Sn/sub 73.9/ solder alloy reflowed on a Ni substrate at 185/spl deg/C for 30 s above liquidus and subsequently annealed at 150/spl deg/C gave rise to two layers of intermetallic compounds at the solder/substrate interface, Ni/sub 3/Sn/sub 4/ and (Au, Ni)Sn/sub 4/. However, when this solder alloy was reflowed at 235/spl deg/C for 30 s above liquidus, only one interface layer was observed, Ni/sub 3/Sn/sub 4/, while the (Au,Ni)Sn/sub 4/ ternary phase was found to grow in the bulk of the solder. The SnAgCu/Au/Ni joints were reflowed for 74 s above liquidus and the peak temperature attained was 244/spl deg/C. (Au,Ni)Sn/sub 4/ phase was observed to form in the bulk of these joints upon reflow, with a Cu content less than 1 atomic percent. This intermetallic compound remained in the bulk of the joint as the samples were annealed at 150/spl deg/C up to 261 hours. For the Au/sub 0.1/Sn/sub 99.9//Ni system, only one layer, the Ni/sub 3/Sn/sub 4/ phase, was found to grow at the solder/substrate interface, both after reflow (at 260/spl deg/C for 46 s above liquidus) and for an annealing schedule at 150/spl deg/C of up to 49 hours.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	161
Ending Page	167
File Size	1099271
Page Count	7
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008090
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Tin Temperature Annealing Nickel alloys Intermetallic Morphology Metallization Gold alloys Atomic layer deposition
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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