NDLI: Structure and kinetics of Sn whisker growth on Pb-free solder finish

Content Provider	IEEE Xplore Digital Library
Author	Choi, W.J. Lee, T.Y. Tu, K.N. Tamura, N. Celestre, R.S. Macdowell, A.A. Bong, Y.Y. Nguyen, L. Sheng, G.T.T.
Copyright Year	2002
Description	Author affiliation: Dept. of Mater. Sci. & Eng., Univ. of Southern California, Los Angeles, CA, USA (Choi, W.J.; Lee, T.Y.; Tu, K.N.)
Abstract	Standard leadframes used in surface mount technology are finished with a layer of eutectic SnPb for passivation and for enhancing solder wetting during reflow. When eutectic SnPb is replaced by Pb-free solder, especially the eutectic SnCu, a large number of Sn whiskers are found on the Pb-free finish. Some of the whiskers are long enough to become shorts between the neighboring legs of the leadframe. How to suppress their growth and how to perform accelerated test of Sn whisker growth are crucial reliability issues in the electronic packaging industry. In this paper, we report the study of spontaneous Sn whisker growth at room temperature on eutectic SnCu and pure Sn finishes. Both compressive stress and surface oxide on Sn are necessary conditions for whisker growth. Structure and stress analyses by using micro-diffraction in synchrotron radiation are reported. Cross-sectional electron microscopy, with samples prepared by focused ion beam, are included.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	628
Ending Page	633
File Size	743330
Page Count	6
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008161
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Kinetic theory Tin Lead Compressive stress Surface-mount technology Passivation Leg Performance evaluation Life estimation Electronic equipment testing
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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