NDLI: Implementation of the Internet course on conductive adhesives for electronics packaging

Content Provider	IEEE Xplore Digital Library
Author	Johan Liu Liqiang Cao Xitao Wang Morris, J.E.
Copyright Year	2002
Description	Author affiliation: Div. of Electron. Production, Chalmers Univ. of Technol., Molndal, Sweden (Johan Liu; Liqiang Cao; Xitao Wang)
Abstract	The authors have developed a course on electrically conductive adhesives for Internet delivery from multiple sites. The paper lays out detailed lecture by lecture content, and details of the experimental sequences, which include both high end analytical techniques and experiments which would be adaptable to any basic undergraduate laboratory environment. Today the course is now installed in an Internet server for easy access. The course starts with a general introduction of conductive adhesive joining technology, followed by a section on ICA part. The course ends with the ACA part of the conductive adhesive technology. Both audio and video techniques are used to facilitate the study.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	1502
Ending Page	1506
File Size	810716
Page Count	5
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008305
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Internet Conductive adhesives Electronics packaging Independent component analysis Conducting materials Anisotropic magnetoresistance Polymers Surface-mount technology Contacts Production
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Development of an Internet course on electrically conductive adhesives with experiments

An Internet course on conductive adhesives for electronics packaging

Electrically Conductive Adhesives

Statistics of electric conductance through anisotropically conductive adhesive

Overview of conductive adhesive joining technology in electronics packaging applications

Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes

Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

An Ontology for Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

Recent advances on electrical conductive adhesives (ECAs)

Implementation of the Internet course on conductive adhesives for electronics packaging

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An Internet course on conductive adhesives for electronics packaging

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Statistics of electric conductance through anisotropically conductive adhesive

Overview of conductive adhesive joining technology in electronics packaging applications

Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes

Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications

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Implementation of the Internet course on conductive adhesives for electronics packaging