NDLI: Generic, Direct-Chip-Attach MEMS packaging design with high density and aspect ratio Through-Wafer Electrical Interconnect

Content Provider	IEEE Xplore Digital Library
Author	Seong Joon Ok Neysmith, J. Baldwin, D.F.
Copyright Year	2002
Description	Author affiliation: Adv. Assembly Process Technol. Lab., Georgia Inst. of Technol., Atlanta, GA, USA (Seong Joon Ok; Neysmith, J.; Baldwin, D.F.)
Abstract	Micro-Electro-Mechanical-Systems (MEMS) are integrated systems combining electrical and mechanical components, which are fabricated using integrated circuit (IC) batch processing techniques. The influence of MEMS is made possible through their benefits in functionality, size, and reliability. In spite of these remarkable and promising achievements in the field of microsystem fabrication, the commercialization of proven devices are lagged far behind expectations, considerably due to high packaging cost, improper packaging design solution and high testing cost. This paper is focused on suggesting and demonstrating a promising generic, modular, Direct-Chip-Attach (DCA), low cost and high reliable MEMS packaging design strategy and solution applying with high aspect ratio Through-Wafer Electrical Interconnect (TWEI). Fabrication of TWEI using dry etching is relatively new technology that can create more and better packaging options than any other conventional packaging design. The various techniques that can make through-wafer vias conductive are demonstrated and analyzed with advantages and drawbacks.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	232
Ending Page	237
File Size	816837
Page Count	6
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008099
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Micromechanical devices Wafer scale integration Dry etching Integrated circuit interconnections Integrated circuit technology Costs Electronic packaging thermal management Electronics packaging Bonding Insulation
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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