NDLI: Understanding lead frame surface treatment and its impact on package reliability

Content Provider	IEEE Xplore Digital Library
Author	Renyi Wang Kuder, R. Bing Wu Emmerson, G.T. Seeley, G.J.
Copyright Year	2002
Description	Author affiliation: Ablestik Labs., Rancho Dominguez, CA, USA (Renyi Wang; Kuder, R.; Bing Wu)
Abstract	Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliability. In this work, detailed investigations were carried out to elucidate the chemical compositions of surface treatment solutions as well as the chemical and physical properties of lead frame surfaces. Results from /sup 1/H nuclear magnetic resonance (NMR), X-ray photoelectron spectroscopy (XPS), optical microscopy, and static secondary ion mass spectroscopy (SSIMS) are described. Adhesion testing data obtained from lead frames with different surface treatments, and with die attach adhesives of various chemistries, are reported. In addition, JEDEC reliability tests, using a new die attach adhesive, were performed on molded packages with different packaging material combinations and the results are reported.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	947
Ending Page	954
File Size	1131140
Page Count	8
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008215
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface treatment Semiconductor device packaging Chemicals Nuclear magnetic resonance Mass spectroscopy Optical microscopy Microassembly Lead compounds Electronics industry Particle beam optics
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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