NDLI: Reliability assessment of flip-chip assemblies with lead-free solder joints

Content Provider	IEEE Xplore Digital Library
Author	Schubert, A. Dudek, R. Walter, H. Jung, E. Gollhardt, A. Michel, B. Reichl, H.
Copyright Year	2002
Description	Author affiliation: Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany (Schubert, A.; Dudek, R.; Walter, H.; Jung, E.; Gollhardt, A.; Michel, B.; Reichl, H.)
Abstract	Due to environmental awareness, and the health hazards involved in using lead in solders, large efforts to develop lead-free soldering have been made in recent years. Sn-Ag alloys are expected to be one of the best candidate lead-free solders. Furthermore, from a reliability viewpoint, there has been interest in improved thermal fatigue resistance of solder interconnects. In this study, two lead-free solder alloys (Sn96.5Ag3.5, Sn95.5Ag3.8Cu0.7) were investigated in comparison to lead-containing solder alloys (Sn63Pb37, Sn59Pb40Ag1). These investigations were focused on mechanical and physical properties (coefficient of thermal expansion, stress-strain curves at different strain-rates) as well as on the microstructural appearance of the solders. The mechanical and thermomechanical behavior of the solders were examined by TMA, DTMA, tensile tests, and creep tests. Constant-load creep tests were performed on the specimens at temperatures from 20/spl deg/C to 150/spl deg/C. Steady-state strain rates spanned seven orders of magnitude ranging from 10/sup -11/ s/sup -1/ to 10/sup -4/ s/sup -1/. The second step is a reliability study of flip-chip assemblies on FR-4 (high T/sub g/ material) with three different underfill materials and with Sn63Pb37, Sn96.5Ag3.5, and Sn95.5Ag4.0Cu0.5 bumps, undergoing thermal cycles from -55/spl deg/C to 125/spl deg/C and -55/spl deg/C to 150/spl deg/C. The deterioration (characterized by electrical resistance and SEM) are described. Furthermore, it is shown that the material parameters obtained from the tests will increase the precision of finite-element analysis for reliability studies of microelectronic packages with lead-free solder interconnects.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	1246
Ending Page	1255
File Size	1236620
Page Count	10
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008266
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Environmentally friendly manufacturing techniques Lead Soldering Testing Thermal resistance Creep Materials reliability Hazards Fatigue
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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