NDLI: Whole field vapor pressure modeling of QFN during reflow with coupled hygro-mechanical and thermo-mechanical stresses

Content Provider	IEEE Xplore Digital Library
Author	Tong Yan Tee Hun Shen Ng
Copyright Year	2002
Description	Author affiliation: STMicroelectronics, Singapore, Singapore (Tong Yan Tee; Hun Shen Ng)
Abstract	A comprehensive and integrated package stress model is established for QFN (Quad Flat Non-lead) packages with consideration of the effects of moisture diffusion, heat transfer, thermo-mechanical stress, hygro-mechanical stress, and vapor pressure induced during reflow. The critical plastic materials, i.e. mold compound and die attach, are characterized for hygroswelling and moisture properties. The moisture absorption during preconditioning at JEDEC Level 1, and moisture desorption at various high temperatures are characterized. The vapor pressure modeling applies the micro-mechanics approach, the Representative Volume Element (RVE), with consideration of the micro-void effect. The vapor pressure can be calculated based on the local moisture concentration after preconditioning. Results show that the vapor pressure saturates much faster than the moisture diffusion, and a near uniform vapor pressure is reached in the package. The vapor pressure introduces additional strain of the same order as the thermal strain and hygro strain to the package. Vapor pressure-induced expansion is directly related to the vapor pressure distribution, rather than the moisture distribution.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	1552
Ending Page	1559
File Size	905024
Page Count	8
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008314
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Semiconductor device modeling Thermomechanical processes Thermal stresses Moisture Packaging Capacitive sensors Heat transfer Plastics Microassembly Absorption
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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