NDLI: Design for reliability of micro-electro-mechanical systems (MEMS)

Content Provider	IEEE Xplore Digital Library
Author	McCluskey, P.
Copyright Year	2002
Description	Author affiliation: A. James Clark Sch. of Eng., Maryland Univ., College Park, MD, USA (McCluskey, P.)
Abstract	This paper describes a proposal to build Internet-based educational materials that describe the fundamental failure mechanisms in micro-electromechanical systems and their packaging, and provide techniques for using this information to design MEMS and microsystems that are less susceptible to failure by those mechanisms. The MEMS device, the structure of the package, and the electrical, optical, mechanical, and fluidic interconnections are addressed. The Internet learning modules will include a mixture of lecture materials (in text format with video/voice over), discussion/homework problems, additional reading, and online simulation tools. The multimedia course materials will be available in Web-based format to universities and companies around the world via a central hosting organization, and will be designed in such a way as to facilitate feedback and the contribution of additional materials. This course is a natural follow-on to a course supported last year by the IEEE/PRC on the Design for Reliability of Electronic Systems (McCluskey, Proc. 51st Electron. Comp. and Techn. Conf., pp. 397-400, 2001). The Internet learning modules created in this project will supplement those developed for electronic systems and will take advantage of material developed for courses and lectures on MEMS and MEMS packaging that have previously been offered at the University of Maryland.
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	760
Ending Page	762
File Size	340935
Page Count	3
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008183
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microelectromechanical systems Micromechanical devices Internet Optical materials Packaging Educational institutions Proposals Failure analysis Microelectromechanical devices Optical devices
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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