NDLI: Rework and reliability of underfilled CSP assemblies

Content Provider	IEEE Xplore Digital Library
Author	Gowda, A. Primavera, A. Rampurawala, M. Srihari, K.
Copyright Year	2002
Description	Author affiliation: Electron. Manuf. Res. & Services, State Univ. of New York, Binghamton, NY, USA (Gowda, A.)
Abstract	Rework processes were developed for four different packages in combination with four underfills. Thermal profiles for component removal and replacement were developed for all the underfills. Several automated sequences were attempted to remove components using an independent pick-up tube, but the vacuum force was insufficient to overcome the adhesion of the underfill between the component and the board. A modified removal sequence and manual twisting motion were required to remove the defective component. Site redressing was performed using a rotary tool and dental brush. The brushing was followed by removal of excess solder using the soldering iron and wick method. New components were placed on the redressed site and soldered. The reworked assembly was then underfilled. Reliability studies were carried out using accelerated testing methods on four different packages in combination with three underfills. The reliability data for non-underfilled assemblies, underfilled assemblies, and reworked assemblies are compared. Accelerated testing conditions were obtained using air-to-air thermal cycling (0 to 100/spl deg/C, 20 minute cycle) and mechanical testing (torsion).
Sponsorship	IEEE Components, Packaging, & Manuf. Technol. Soc. Electronic Components, Assemblies & Mater. Assoc
Starting Page	458
Ending Page	466
File Size	1070651
Page Count	9
File Format	PDF
ISBN	0780374304
ISSN	05695503
DOI	10.1109/ECTC.2002.1008136
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-28
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Life estimation Chip scale packaging Electron tubes Adhesives Dentistry Brushes Soldering Iron Testing
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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