NDLI: Influence of microstructure on power dissipation in bulk Y-Ba-Cu-O structures

Content Provider	IEEE Xplore Digital Library
Author	Askew, T.R. Metzler, M.G. Herron, M.S. Button, T.W.
Copyright Year	2002
Abstract	The relatively low values of critical current density (J/sub C/) in bulk high T/sub C/ materials are a problem for many applications, but these materials are now ending use in developmental fault current limiters of various design. Intended primarily for AC power applications, these devices rely on materials that transition quickly between a state of effectively lossless conduction and a state which dissipates significant power directly or significantly changes the magnetic coupling between other circuit elements. Most bulk material processes have been adjusted to maximize the value of J/sub C/ rather than to provide the well defined, sharp transition just mentioned. This study compares the dissipative properties of sintered YBCO with equiaxed, unoriented grains to that of two different types of melt-processed thick film material with plate-like grains in c-axis orientation. Dissipative properties are measured under current densities of 10 times J/sub C/ or more. Isothermal conditions are maintained through the use of submillisecond feedback-controlled current pulses. Significant differences are noted in the high-current flux flow properties, with the sintered samples developing Ohmic behavior and the samples with oriented microstructures developing voltages proportional to I/sup 2/. Sharp transitions at J/sub C/ and extreme dependence on applied magnetic field were noted in all cases.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	1600
Ending Page	1603
Page Count	4
File Size	475407
File Format	PDF
ISSN	10518223
Volume Number	7
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Power dissipation Yttrium barium copper oxide Conducting materials Magnetic materials Critical current density Fault current limiters Magnetic devices Magnetic flux Coupling circuits
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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