NDLI: Magnetic field modulation of critical currents in YBaCuO co-planar Josephson junctions using focused ion beam

Content Provider	IEEE Xplore Digital Library
Author	Soutome, Y. Okabe, Y.
Copyright Year	2002
Abstract	The YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// co-planar Josephson junctions by Focused Ion Beam were fabricated by changing the width and the thickness of a YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// thin film. The magnetic properties of the junctions were measured at different temperatures. In the junction with 300 nm thickness, the magnetic field modulation of the critical current at 4.2 K was not observed. Near the critical temperature of the junction, the magnetic modulation curve was similar to that of a dc-SQUID. From the SEM observation, some microshorts were observed on the junction. In the junction with 200 nm thickness, the I-V curve was changed from flux-flow junction type to RSJ type. The magnetic modulation curve of the 7 /spl mu/m wide junction at 4.2 K was similar to a Fraunhofer pattern. Thus it is considered that the coupling region was changed from a microshort to weak coupling region, when the thickness of the YBaCuO film was decreased from 300 nm to 200 nm.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	2311
Ending Page	2314
Page Count	4
File Size	658813
File Format	PDF
ISSN	10518223
Volume Number	7
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Magnetic fields Magnetic modulators Critical current Yttrium barium copper oxide Magnetic field measurement Temperature measurement Josephson junctions Ion beams Transistors Magnetic properties
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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