NDLI: Transport critical currents of Bi(2223) tapes at 77 K under mechanical stress

Content Provider	IEEE Xplore Digital Library
Author	Ullmann, B. Gabler, A. Quilitz, M. Goldacker, W.
Copyright Year	2002
Abstract	The transport critical current, j/sub c/, depends on the mechanical stress applied during or before the j/sub c/-determination. Two experiments with different aims were performed : a) bending of the tape tests the resistance against winding (coils, power cables); b) axial strain tests give information on the effect of forces acting on the conductor during operation. Bending of Bi(2223)/Ag tapes from a radius r=/spl infin/ to r=1 cm as well as an axial strain of about 0.2% decreases j/sub c/ by some 80%. For bent as well as for elongated tapes, we find an almost unaffected field dependence of j/sub c/, which is only on a lower j/sub c/ level due to crack formation, i.e. a reduction of the percolation path. The strong j/sub c/ reduction can be avoided by reinforcement of the sheath material by dispersion hardening with 2% Mg. The j/sub c/ decrease after bending in these improved tapes is only some 20%, the maximum axial strain tolerance about 0.8%. The yield of the reinforced tapes is 300-350 MPa, which is more than 5 times the value for Ag sheathed tapes.
Sponsorship	Council on Superconductivity Appl. Superconductivity Conference Inc MIT
Starting Page	2042
Ending Page	2045
Page Count	4
File Size	418275
File Format	PDF
ISSN	10518223
Volume Number	7
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-06-01
Publisher Place	U.S.A.
Access Restriction	One Nation One Subscription (ONOS)
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Magnetic field measurement Superconducting magnets Magnetic field induced strain Capacitive sensors Conductors High temperature superconductors Tensile stress Superconducting cables Powders Stress measurement
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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